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A robust, ultra low-power, data-dependent-power-supplied 11T SRAM cell with expanded read/write stabilities for internet-of-things applications (2019)

Sharma. V, Gopal. M, Singh. P, Vishvakarma1. S, Chouhan. S
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Are You Tampering with My Data? (2019)

Alberti. M, Pondenkandath. V, Würsch. M, Bouillon. M, Seuret. M, Ingold. R, et al.
Ingår i: Computer Vision – ECCV 2018 Workshops, Proceedings, Part II, s. 296-312, Springer, 2019
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Detection of particle contaminants in rolling element bearings with unsupervised acoustic emission feature learning (2019)

Martin del Campo Barraza. S, Schnabel. S, Sandin. F, Marklund. P
Tribology International, ISSN: 0301-679X, Vol. 132, s. 30-38
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Field test of neural-network based automatic bucket-filling algorithm for wheel-loaders (2019)

Dadhich. S, Sandin. F, Bodin. U, Andersson. U, Martinsson. T
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Maximal Q Factor for an On-Chip, Fuse-Based Trimmable Capacitor (2019)

Nilsson. J, Borg. J, Johansson. J
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System of System Composition based on Decentralized Service Oriented Architecture (2019)

Derhamy. H, Eliasson. J, Delsing. J
IEEE Systems Journal, ISSN: 1932-8184
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A delay‐rational model of electromagnetic interference on multiconductor transmission lines (2018)

Biello. E, Antonini. G, De Lauretis. M, Ekman. J
International journal of numerical modelling, ISSN: 0894-3370, Vol. 31, nr. 4
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A haptic navigation aid for individuals with visual impairments (2018)

Indoor and outdoor feasibility evaluations of the LaserNavigator
Röijezon. U, Prellwitz. M, Innala Ahlmark. D, van Deventer. J, Nikolakopoulos. G, Hyyppä. K
Journal of Visual Impairment & Blindness, ISSN: 0145-482X

A Low Cost Omnidirectional Relative Localization Sensor for Swarm Applications (2018)

Kohlbacher. A, Eliasson. J, Acres. K, Chung. H, Barca. J
Ingår i: IEEE 4th World Forum on Internet of Things, s. 694-699, Institute of Electrical and Electronics Engineers (IEEE), 2018

A more accurate electromagnetic modeling of WBG power modules (2018)

Kovačević-Badstübner. I, Grossner. U, Romano. D, Antonini. G, Ekman. J
Ingår i: Proceedings of the International Symposium on Power Semiconductor Devices and ICs, s. 260-263, Institute of Electrical and Electronics Engineers (IEEE), 2018