EISLAB Electronics Production

 

Future electronics circuits will be produced with a sequential build up, SBU, approach. Here chip and passive components, connectors and power supply will be connected by through electroless copper processes. This process will be a major advancement of the current embedded chip technologies. Thus we are foreseeing the replacement of technologies like bonding, chip encapsulation, and soldering with an embedded component approach based on SBU technology.

At EISLAB we are investigating three critical technologies for this embedded component SBU approach: