EISLAB Electronics Production

 

Future electronics circuits will be produced with a sequential build up, SBU, approach. Here chip and passive components, connectors and power supply will be connected by through electroless copper processes. This process will be a major advancement of the current embedded chip technologies. Thus we are foreseeing the replacement of technologies like bonding, chip encapsulation, and soldering with an embedded component approach based on SBU technology.

At EISLAB we are investigating three critical technologies for this embedded component SBU approach:

1um Chip Interconnect

[http://www.ltu.se/research/subjects/EISLAB-industriell-elektronik/2.56667/Pagaende-Projekt/1um-Chip-Interconnect?l=en]

Embedded Passives

[http://www.ltu.se/research/subjects/EISLAB-industriell-elektronik/2.56667/Pagaende-Projekt/Embedded-Passives?l=en]

Test Methods for SMT and SBU Circuits

[http://www.ltu.se/research/subjects/EISLAB-industriell-elektronik/2.56667/Pagaende-Projekt/Test-Methods-for-SMT-and-SBU-Circuits?l=en]

 

Luleå University of Technology is experiencing strong growth with world-leading competence in several areas of research. Our research is conducted in close cooperation with companies such as Bosch, Ericsson, Scania, LKAB, SKF and leading international universities. Luleå University of Technology has a total turnover of SEK 1.6 billion per year. We currently have 1,700 employees and 15,000 students.

 

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