Additive Manufacturing
Electronics and software integration: Targeting integration ranging from high-density electronics interconnection at circuit board level, chip design and interconnection, computational hardware integration to microsystems and microservices paradigms. Enabling integration and interoperability from electronics production processes, electronics computing paradigms to microsystems and microservices software.
One of our key competencies supporting this direction is additive integration of high density electronics addressing the current technological gap to produce metal patterns on polymer substrates with feature sizes in the range of 1-20 um.
Current projects
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COMPACT
The worldwide consumer electronics market is focusing nowadays on manufacturing high-density interconnects printed circuit boards (HDI PCBs) due to continuous demands in complex functionalities like smartphones, tablet computers and wearable devices.