COMPACT
The worldwide consumer electronics market is focusing nowadays on manufacturing high-density interconnects printed circuit boards (HDI PCBs) due to continuous demands in complex functionalities like smartphones, tablet computers and wearable devices.
Thus, identifying this as an opportunity for local PCB industries in the North, Luleå University of Technology is working on development of fully additive metallization technology where the interconnects are scalable down to line-and spacing of 5 um/5um. The work is in active co-operation with University of UOULU Finland where the university is contributing to the reliability testing of the developed process technology.
Aim of the EU funded project is to deliver a cost-effective advanced electronic packaging methodology to the Printed Circuit Board Industries situated in the Northern part of Sweden and Finland with managed reliability.
The work has been financed by the Interreg Nord, European Regional Development Fund (ERDF).
Updated: